Theglobal die attach materials marketis experiencing highly competitive landscape as the leading players in the market are concentrating in using leading-edge techniques for production, as analyzed by Transparency Market Research (TMR). The regular use of these technologies will decrease the overall manufacturing cost incurred. However, they are expected to face certain challenges for raw material procurement mainly because of fluctuating prices of conductive polymers and pure metals. Some of the main players in the market are Alpha Assembly Solutions, Dow Corning Corporation, Henkel, Master Bond Inc., AI Technology, Creative Materials Inc., and Hybond Inc.
According to the author of the report by TMR, the die-attach materials market is projected to expand at a steady CAGR of 3.1% during the forecast tenure from 2017 to 2026. The market value is estimated to reach US$ 970 mn by the end of the forecast period in 2026. The category based on type of form of die-attach materials in which paste-based segment is expected to see high growth during the forecast period. According to the geographical analysis, Asia Pacific excluding Japan (APEJ) holds the major market share. The major producers of die-attach materials are China and South Korea have contributed significantly and is expected to gain 70% of revenue by the end of 2026.
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The report segments the Global Die-attach Materials Market into the following:
Global Die-attach Materials Market, by Product
- Adhesives
- Sintering
- Films
- Solder
- Others
Global Die-attach Materials Market, by Material
- Polymer Adhesives
- Eutectic Die Attach Materials
- Other
Global Die-attach Materials Market, by Form
- Powder
- Pastes
- Wires
